Detailed properties
Manufacturer | NXP | Date Code | 2121 |
Package | Quantity | 9999 |
description:
S9S08DZ60F2MLHR |
S9S08DZ60F2MLH |
SC33771CTA1MAE |
MC33907NAE |
FX32K144HAT0MLHT |
S9KEAZ64AMLH |
MC33664ATL1EG |
S9S08DZ128F2MLH |
FS32K146HFT0VLHT |
S912ZVC12F0VLFR |
LPC1758FBD80 |
LPC4320FBD144 |
CV520 |
JN5169/001 |
LPC1765FBD100 |
MFRC52302HN1 |
MMA8451QT |
PCF7991AT/1081/M |
PN5321A3HN/C106 |
MFRC52202HN1 |
S912XDT256F1MAL |
S9S12G128AMLH |
S9S12G64F0MLH |
TDA8547TS/N1 |
TDA8920CTH |
TEA1761T |
TEA19161T/2Y |
TEA1995T/1J |
TEF6638HW/V106K |
S9S08DZ60F2MLH |
SC33771CTA1MAE |
Recommend
More>
MPN | Manufacturer | Date Code | Quantity | Package | Contact |
---|---|---|---|---|---|
FM93C46A-SO-T-G | FUDAN MICRIO | 23+ | 45000 | Contact | |
AGQ200A4H | PANASONIC | 23+ | 5600 | DIP | Contact |
TEF8102EN/N1Y | NXP | 22+ | 50000 | BGA | Contact |
MB10F | TOSHIBA | 23+ | 88800 | SOP4 | Contact |
REF192GSZ-REEL7 | ADI | 23+ | 5560 | SOIC-8 | Contact |
W632GU6NB-11 | WinBond | 23+ | 5500 | BGA | Contact |