Tel：

Shangcheng Vision

SOC Chips | CMOS Sensor | MCU | Communication Chips | Memory Chips | Chips |

比亚迪BF3063/30A2/3149/4A/3237/3238/3901/3905/3925/3A03芯片

比亚迪BF3063/30A2/3149/4A/3237/3238/3901/3905/3925/3A03芯片

MPN

BF3063

Manufacturer

BYD

Package

BGA

Date Code

23+

Quantity

2600

Contact

Contact us

Tel：
Q Q：
Email：
WeChat：

Details

Detailed properties

Manufacturer	BYD	Date Code	23+
Package	BGA	Quantity	2600

description：

全系列芯片

BF2013

BF20A1

BF20A6

BF2253-L

BF2257

BF2553

BF2841

BF3005

BF3031

BF3043

BF3063

BF30A2

BF3149

BF314A

BF3237

BF3238

BF3901

BF3905

BF3925

BF3A03

Recommend More>

MPN	Manufacturer	Date Code	Quantity	Package	Contact
LM2903DR	TI	23+	2880	BGA	Contact
CC0805ZKY5V6BB106	YAGEO	23+	3000	0805	Contact
SL02-GS08	VISHAY	23+	888800	SMA	Contact
IMX334LQR-C	SONY	23+	99990	CLCC	Contact
MSC313E	SIGMASTAR	23+	99990	QFN80	Contact
ACT8865QI305-T	Qorvo	21+	3000	TQFN-32	Contact