Detailed properties
Manufacturer | SAMSUNG | Date Code | 21+ |
Package | FBGA-178 | Quantity | 2000 |
description:
Recommend
More>
MPN | Manufacturer | Date Code | Quantity | Package | Contact |
---|---|---|---|---|---|
TLIN1021DRQ1 | TI | 21+ | 2500 | SOIC-8 | Contact |
NVP6321 | NEXTCHIP | 23+ | 26000 | QFP | Contact |
W25Q64FVSSIG | WinBond | 22+ | 88800 | SOP8 | Contact |
MSP430F135IPMR | TI | 22+ | 88800 | LQFP64 | Contact |
USB2514BI-AEZG-TR | MICROCHIP | 23+ | 88800 | QFN32 | Contact |
SKRTLAE010 | ALPSALPINE | 23+ | 45000 | Contact |