Detailed properties
Manufacturer | SAMSUNG | Date Code | 2021 |
Package | Quantity | 9898 |
description:
Recommend
More>
MPN | Manufacturer | Date Code | Quantity | Package | Contact |
---|---|---|---|---|---|
503182-1852 | MOLEX | 2021 | 9898 | Contact | |
7805 | TOSHIBA | 23+ | 9898 | BGA | Contact |
SGM9144CXMS8G/TR | SGMICRO | 23+ | 40000 | MSOP-10 | Contact |
HI3516AV200 | HISILICON | 2018 | 240000 | TFBGA | Contact |
MAX3221EAE+T | ADI | 23+ | 88800 | SOIC-8 | Contact |
CA-IS3721HS | Chipanalog | 23+ | 23200 | SOP16 | Contact |