Detailed properties
Manufacturer | SAMSUNG | Date Code | 22+ |
Package | QFP48 | Quantity | 888000 |
description:
Recommend
More>
MPN | Manufacturer | Date Code | Quantity | Package | Contact |
---|---|---|---|---|---|
JX-H66-C1-D6 | SOI | 23+ | 88800 | CSP | Contact |
HI3519V101 | HISILICON | 2018 | 240000 | FC-CSP524 | Contact |
IMX420LQJ-C | SONY | 23+ | 5600 | CLCC | Contact |
EC800MCNGA-I05-SGNSA | Quectel | 23+ | 10000 | SMD | Contact |
NT96658MBG | NOVATEK | 23+ | 88800 | BGA | Contact |
W9864G6JH-6 | WinBond | 23+ | 5500 | BGA | Contact |