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K4ZAF325BM-HC14芯片一级代理商分销SAMSUNG三星集成电路全新原装IC现货供应

K4ZAF325BM-HC14芯片一级代理商分销SAMSUNG三星集成电路全新原装IC现货供应

MPN

K4ZAF325BM-HC14

Manufacturer

SAMSUNG

Package

BGA

Date Code

22+

Quantity

888000

Contact

Contact us

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Details

Detailed properties

Manufacturer	SAMSUNG	Date Code	22+
Package	BGA	Quantity	888000

description：

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