Detailed properties
| Manufacturer | SAMSUNG | Date Code | 22+ |
| Package | BGA | Quantity | 88800 |
description：
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|---|---|---|---|---|---|
| STM32F103C8T6 | ST | 2021/2/3 | 2500 | Contact | |
| STM32F407IGT6 | ST | 2021/2/3 | 400 | Contact | |
| HI3516DRBCV300 | Hisilicon | 20+ | 1190 | BGA | Contact |
| AR9342-BL1A | QUALCOMM高通 | 21+ | 2000 | QFN-148 | Contact |
| THCV231 | THine | 23+ | 15000 | TSSOP56 | Contact |
| STM32F103ZCT6 | ST | 2021/2/3 | 600 | Contact |