Detailed properties
Manufacturer | SILEAD/思立微 | Date Code | 22+ |
Package | QFN | Quantity | 300000 |
description:
Recommend
More>
MPN | Manufacturer | Date Code | Quantity | Package | Contact |
---|---|---|---|---|---|
HI3535V100 | HISILICON | 2018 | 60000 | EDHS-PBGA563 | Contact |
L9733CNTR | ST | 22+ | 2500 | HSOP-10 | Contact |
IRLML0030TRPBF | INDINEON | 23+ | 88800 | TO247 | Contact |
DP83640TVVX | TI | 22+ | 30000 | UFQFN-10 | Contact |
SIT3088EEPA | SIT | 23+ | 10000 | SOP8 | Contact |
W25Q64JVXGIQ | WinBond | 23+ | 5500 | BGA | Contact |