Detailed properties
Manufacturer | SIMCOM | Date Code | 23+ |
Package | SMD | Quantity | 30000 |
description:
SIMCOM芯讯通无线科技2G/3G/4G/5G模块全系列现货:
SIM800C
A7680C-LAAS
SIM800C 24Mbit
SIM800C 32Mbit
SIM7080G
SIM7600CE-T
SIM7020C
SIM868
SIM800F
A7600C1-LNSE
A7670C-MASL
SIM7000E
SIM7600E
A7670C-FASL
SIM7600CE-L1S
A7670C-LASE
SIM808
SIM7020E
A7670C-LASS
Y7025
SIM7600A
SIM68D
SIM7600CE-L
SIM7000C
SIM5320A
SIM800
SIM7600CE-L1S-PCIE
SIM7000A
SIM800C24_BT
SIM7600CE-CNSE-PCIE
SIM868-L
SIM7500E
SIM800A
SIM68M
SIM800C24
A7670C-FASS
SIM7600CE-CNSE-PCIE
A7630C-LAAS
SIM7600CE-M1S
SIM800H
SIM33EAU
SIM5360A
SIM5320E
SIM7500A
SIM5360E
SIM7100E
SIM7600G-H-PCIE
SIM5360J
SIM5320J
SIM6320C
Recommend
More>
MPN | Manufacturer | Date Code | Quantity | Package | Contact |
---|---|---|---|---|---|
K4E6E304EC-EGCF | SAMSUNG | 21+ | 1280 | BGA178 | Contact |
K4B8G1646Q-MYK0 | SAMSUNG | 22+ | 128000 | BGA | Contact |
W25Q80DVSSIG | WinBond | 23+ | 5500 | BGA | Contact |
1909763-1 | TE | 2021 | 9898 | Contact | |
AP6212 | AMPAK/正基 | 23+ | 150000 | QFN-44 | Contact |
TBD62003AFG(Z) | TOSHIBA | 23+ | 50000 | BGA | Contact |