Manufacturer | TD | Date Code | 23+ |
Package | BGA | Quantity | 23250 |
亿存芯(TD)>
TD25CM01-C
TD25C512-C1
TD24CM02-C
TD24CM01-C
TD24C512-C1
TD24C512-C
TD24C256-C
TD24C128-C1
TD24C64-C1
TD24C64-C0
TD24C32-C1
TD24C16-C
TD25CM01-H
TD25C512-H
TD25C256-H
TD25C128-H
TD25C64-H
TD24CM01-H
TD24C512-H
TD24C256-H
TD24C128-H
TD24C64-H1
TD24C32-H1
TD24C16-H
TD24C08-H
TD24C04-H
TD24C02-H
TD24C01-H
34TS04
TD34C04
TD34C02
TD25CM02-R
TD25CM01-R
TD25C512-R
TD25C256-R
TD25C128-R
TD25C64-R
TD24CM02-R
TD24CM01-R
TD24C512-R1
TD24C512-R
TD24C256-R
TD24C128-R1
TD24C64-R1
TD24C64-R0
TD24C32-R
TD24C16-R
TD24C08-R0
TD24C04-R0
TD24C02-R0
TD24C01-R0
TD24C16-R1
TD24C08-R1
TD24C04-R1
TD24C02-R1
MPN | Manufacturer | Date Code | Quantity | Package | Contact |
---|---|---|---|---|---|
TEF6638HW/V106Z | NXP | 22+ | 45000 | HTQFP-100 | Contact |
W971GG6NB25I/TRAY | WINBOND | 23+ | 88800 | WBGA-84 | Contact |
LT3652IMSE#TRPBF | ADI | 23+ | 88800 | SOIC-8 | Contact |
RK3326+RK817-1 | Rockchip | 23+ | 6000 | BGA | Contact |
DS2431P+T&R | MAXIM | 21+ | 4000 | TSOC-6 | Contact |
MCP9701AT-E/TT | MICROCHIP | 23+ | 2880 | BGA | Contact |