Detailed properties
Manufacturer | NXP | Date Code | 22+ |
Package | LQFP-80 | Quantity | 48000 |
description:
S9S08DZ60F2MLHR |
S9S08DZ60F2MLH |
SC33771CTA1MAE |
MC33907NAE |
FX32K144HAT0MLHT |
S9KEAZ64AMLH |
MC33664ATL1EG |
S9S08DZ128F2MLH |
FS32K146HFT0VLHT |
S912ZVC12F0VLFR |
LPC1758FBD80 |
LPC4320FBD144 |
CV520 |
JN5169/001 |
LPC1765FBD100 |
MFRC52302HN1 |
MMA8451QT |
PCF7991AT/1081/M |
PN5321A3HN/C106 |
MFRC52202HN1 |
S912XDT256F1MAL |
S9S12G128AMLH |
S9S12G64F0MLH |
TDA8547TS/N1 |
TDA8920CTH |
TEA1761T |
TEA19161T/2Y |
TEA1995T/1J |
TEF6638HW/V106K |
S9S08DZ60F2MLH |
SC33771CTA1MAE |
Recommend
More>
MPN | Manufacturer | Date Code | Quantity | Package | Contact |
---|---|---|---|---|---|
STM32F429IGT6 | ST | 2021/2/3 | 400 | Contact | |
RS1MSWFQ-7 | LITEON | 23+ | 888800 | SOD123 | Contact |
W9412G6KH-5 | WinBond | 23+ | 5500 | BGA | Contact |
MCP4728-E/UN | MICROCHIP | 23+ | 30000 | QFN36 | Contact |
AP6256 | AMPAK/正基 | 23+ | 150000 | QFN44 | Contact |
HI3516DRBCV200 | Hisilicon | 2032 | 9999 | BGA | Contact |