Detailed properties
Manufacturer | AMPAK/正基 | Date Code | 23+ |
Package | BGA | Quantity | 2300 |
description:
AMPAK/正基全系列原装现货:
AP6212
AP6236
AP6255
AP6256
AP6330
AP6356SA
AP6398S
AP6275S
AP6275P
AP6181
Recommend
More>
MPN | Manufacturer | Date Code | Quantity | Package | Contact |
---|---|---|---|---|---|
TPA2012D2RTJR | TI | 23+ | 30000 | UFQFN-10 | Contact |
NDS331N | ON | 23+ | 2880 | CSP | Contact |
W25Q128JVPIQ | WinBond | 22+ | 88800 | WSON8 | Contact |
AR0135CS2M00SUEA0-DRBR | OSEMI安森美 | 22+ | 32566 | Contact | |
MMBT3904LT1G | ON | 23+ | 3250 | BGA | Contact |
GK7202RNCFV300 | GOKE | 23+ | 13600 | BGA | Contact |