Detailed properties
| Manufacturer | SAMSUNG | Date Code | 2021 |
| Package | Quantity | 9898 |
description：
Recommend
More>
| MPN | Manufacturer | Date Code | Quantity | Package | Contact |
|---|---|---|---|---|---|
| 74HC165D-Q100,118 | Nexperia | 23+ | 8500 | SOP | Contact |
| CH376S | WCH南京沁恒 | 23+ | 2500 | SOIC-28 | Contact |
| SGM4514XPMS8G/TR | SGMICRO | 23+ | 40000 | MSOP-10 | Contact |
| MCP2515-E | MICROCHIP | 23+ | 30000 | QFN36 | Contact |
| STM32F207VCT6 | ST | 2021/2/3 | 900 | Contact | |
| BF3031 | BYD | 23+ | 2600 | BGA | Contact |