Detailed properties
| Manufacturer | SAMSUNG | Date Code | 2021 |
| Package | Quantity | 56959 |
description：
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| MPN | Manufacturer | Date Code | Quantity | Package | Contact |
|---|---|---|---|---|---|
| ST-LINK/V2 | ST | 23+ | 25000 | HSOP-10 | Contact |
| EC600MCNLA-I05-SNNDA | Quectel | 23+ | 10000 | SMD | Contact |
| TPS7A4701RGWR | TI | 23+ | 2880 | BGA | Contact |
| HI3520DV200 | HISILICON | 2018 | 360000 | LQFP256 | Contact |
| LM5069MM-2/NOPB | TI | 23+ | 2880 | BGA | Contact |
| BAV99 | TOSHIBA | 23+ | 48598 | BGA | Contact |