Detailed properties
Manufacturer | SAMSUNG | Date Code | 2021 |
Package | Quantity | 36365 |
description:
Recommend
More>
MPN | Manufacturer | Date Code | Quantity | Package | Contact |
---|---|---|---|---|---|
STM8S003F3P6 | ST | 2021 | 1200 | Contact | |
PX5 | Rockchip | 23+ | 6000 | BGA | Contact |
88E1112-C2-NNC1C000 | MARVELL | 23+ | 8800 | BGA | Contact |
SI9243AEY-T1-E3 | Vishay威世 | 22+ | 88800 | SOP8 | Contact |
S3C6410XH-66 | SAMSUNG | 22+ | 119000 | BGA424 | Contact |
SC4335 | SMARTSENS | 23+ | 26800 | CSP | Contact |