Tel：

Shangcheng Vision

SOC Chips | CMOS Sensor | MCU | Communication Chips | Memory Chips | Chips |

K4E8E324EB-EGCF芯片一级代理商分销SAMSUNG三星集成电路全新原装IC现货供应

K4E8E324EB-EGCF芯片一级代理商分销SAMSUNG三星集成电路全新原装IC现货供应

MPN

K4E8E324EB-EGCF

Manufacturer

SAMSUNG

Package

FBGA-178

Date Code

22+

Quantity

200000

Contact

Contact us

Tel：
Q Q：
Email：
WeChat：

Details

Detailed properties

Manufacturer	SAMSUNG	Date Code	22+
Package	FBGA-178	Quantity	200000

description：

Recommend More>

MPN	Manufacturer	Date Code	Quantity	Package	Contact
MAX232IDR	TI	23+	2880	BGA	Contact
AD623ARZ	ADI	23+	2880	BGA	Contact
TD24C128-C1	TD	22+	23250		Contact
STM32F105VCT6	ST	23+	1500	BGA176	Contact
MBR20100CT	LITEON	23+	88800	TO-220	Contact
ISX017-OAWR-C	SONY	23+	99990	CLCC	Contact