Detailed properties
Manufacturer | SAMSUNG | Date Code | 22+ |
Package | BGA | Quantity | 128000 |
description:
Recommend
More>
MPN | Manufacturer | Date Code | Quantity | Package | Contact |
---|---|---|---|---|---|
CA-IS3722HG | Chipanalog | 23+ | 23200 | SOP16 | Contact |
CMS8S6990-SSOP24 | CMSEMICON/中微 | 22+ | 65000 | SSOP24 | Contact |
GD25LQ32DSIGR | GD | 22+ | 1600 | LQFP-64 | Contact |
CH395L | WCH南京沁恒 | 23+ | 32000 | BGA | Contact |
STM32F103RCT6TR | ST | 23+ | 1500 | BGA176 | Contact |
MM32SPIN27PF | MINDMOTION | 21+ | 2500 | LQFP48 | Contact |