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K4ZAF325BM-HC14芯片一级代理商分销SAMSUNG三星集成电路全新原装IC现货供应

K4ZAF325BM-HC14芯片一级代理商分销SAMSUNG三星集成电路全新原装IC现货供应

MPN
K4ZAF325BM-HC14
Manufacturer
SAMSUNG
Package
BGA
Date Code
22+
Quantity
888000
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Detailed properties
Manufacturer SAMSUNG Date Code 22+
Package BGA Quantity 888000
description: