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TC358743XBG 供应芯片

TC358743XBG 供应芯片

MPN
TC358743XBG
Manufacturer
TOSHIBA
Package
BGA
Date Code
23+
Quantity
5482
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Detailed properties
Manufacturer TOSHIBA Date Code 23+
Package BGA Quantity 5482
description:

TOSHIBA东芝MOSFET系列现货:

TPH1R403NL

SSM3J328R,LF

T2N7002BK,LM

TPH3R704PL,L1Q

SSM3J332R,LF

T2N7002AK,LM

TPH1R403NL,L1Q(M

2SK3878(STA1,E,S)

TK10A80E,S4X

SSM3K324R,LF

2SK2009(TE85L,F)

SSM3J332R,LF(T

SSM6J507NU,LF

SSM3K341R,LF

SSM3J351R,LF

TBD62003AFWG(Z,EHZ

SSM3K329R,LF

2SK209-Y(TE85L,F)

SSM6J501NU,LF

SSM3K37FS,LF

SSM3K15AMFV,L3F(T

SSM3J356R,LF

SSM3K333R,LF(T

SSM3J334R,LF(T

SSM3J338R,LF

SSM3K336R.LF

TPN11006NL,LQ

TPHR9003NL,L1Q

TK100E10N1,S1X(S